Soldering & Surface Mount Technology
Issue(s) available: 129 – From Volume: 1 Issue: 1, to Volume: 36 Issue: 3
A study on the effect of the geometric properties and surface defects on silicon chip flexibility for wearable electronics
Yan Pan, Taiyu Jin, Xiaohui Peng, Pengli Zhu, Kyung W. PaikThe purpose of this paper was to investigate how variations in the geometry of silicon chips and the presence of surface defects affect their static bending properties. By…
Elastoplastic nanoindentation behaviors of sintered nano-silver under various sintering parameters
Yanwei Dai, Libo Zhao, Fei Qin, Si ChenThis study aims to characterize the mechanical properties of sintered nano-silver under various sintering processes by nano-indentation tests.
The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance
Bingyi Li, Songtao Qu, Gong ZhangThis study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide…
Influences of hygrothermal conditions and structure parameters on moisture diffusion behavior in a system‐in‐package module by moisture-thermal-mechanical-coupled finite element modeling
Li Liu, Chunhua Zhang, Ping Hu, Sheng Liu, Zhiwen ChenThis paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with…
Influence of doping Si3N4 nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate
Kai Deng, Liang Zhang, Chen Chen, Xiao Lu, Lei Sun, Xing-Yu GuoThis study aims to explore the feasibility of adding Si3N4 nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang