close
e-Journal Details
Title: IEEE Transactions on Electronics Packaging Manufacturing
Abbrev: IEEE T ELECTRON PA M
Abbrev: ELECTRONICS PACKAGING MANUFACTURING, IEEE TRANSACTIONS ON
Abbrev: IEEE TRANS. ELECTRON. PACKAG. MANUF
Abbrev: IEEE T ELECTRON PACK
ISSN: 1521-334X
LCCN: 2005215258
CODEN: ITEPFL
Peer-Reviewed: Yes
 
Availability: IEEE Electronic Library (IEL)
 
Available from 1999 volume: 22 issue: 1 until (and including) 2010 volume: 33 issue: 4
Authentication: NTK
 
Availability: IEEE Electronic Library (IEL) Journals
 
Available from 1999 volume: 22 issue: 1 until (and including) 2010 volume: 33 issue: 4
Authentication: NTK
 
Categories:
Engineering: Electrical Engineering
Engineering: Electronics
Material Science and Metallurgy: Packaging Materials & Technology
 
Journal History:
Continues: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C [1083-4400]
Merged into: IEEE Transactions on Advanced Packaging [1521-3323]
Merged into: IEEE Transactions on Components and Packaging Technologies [1521-3331]
Merged into: Ieee Transactions on Components Packaging and Manufacturing Technology [2156-3950]